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HEDIC Equipment Gap Financing Pre-Application Form

  • The purpose of the Equipment Gap Financing Loan Program is to support the growth of Holyoke manufacturers including new jobs for Holyoke residents.
  • BANK LOAN:HEDIC LOAN: $ (Limited to 30% of total project cost or up to $100,000, whichever is less.)OWNER CONTRIBUTION:OTHER:TOTAL PROJECT COST:
  • MM slash DD slash YYYY
  • Based on the information provided in this pre-application, applicants that meet the program criteria will be invited to submit a full application. Please refer to the Policies and Procedures document for detailed program guidelines. For questions or additional information, contact the HEDIC staff at (413) 322-5655.
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